PCB Quality Control
Comprehensive inspection and testing processes including AOI, X-ray, flying probe, impedance control, and final electrical verification.
| Parameter | 2022 Sample | 2022 Mass Production | 2023 Sample | 2023 Mass Production |
|---|---|---|---|---|
| Layer Count | 40L | 32L | 50L | 36L |
| Finished Board Thickness | 0.2-12.0mm | 0.4-6.0mm | 0.2-15.0mm | 0.3-7.0mm |
| Thickness Tolerance | ±8% | ±10% | ±8% | ±8% |
| Min Trace/Space | 2mil/2mil | 3mil/3mil | 1.5mil/1.5mil | 2mil/2mil |
| Min Hole-to-Trace Clearance | 5mil | 6mil | 5mil | 5mil |
| Copper Weight | 1-10oz | 1-6oz | 1-12oz | 1/3-8oz |
| Layer Registration Accuracy | 1mil | 1mil | 0.8mil | 1mil |
| Min Through Hole Diameter | 0.1mm | 0.15mm | 0.075mm | 0.10mm |
| Min Blind/Buried Via Diameter | 0.075mm | 0.075mm | 0.05mm | 0.075mm |
| Max Aspect Ratio | 30:1 | 25:1 | 35:1 | 30:1 |
| Etching Tolerance | ±10%/±1mil | ±10%/±1mil | ±10%/±0.8mil | ±10%/±1mil |
| Min Solder Bridge | 3mil | 4mil | 2mil | 3mil |
| Impedance Control Tolerance | ±5% | ±8% | ±5% | ±7% |
| HDI Level | 7th Order | 3rd Order | 9th Order | 5th Order |
| Surface Finish | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon |
| Material Types | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) |
| Category | Parameter | Sample | Mass Production |
| Material Type | Material System | PTFE, Hydrocarbon Resin, Other Materials | PTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber |
| Layer Capability | Layer Count | 24L | 20L |
| Layer Capability | Panel Size | 850×700mm | 720×650mm |
| Profile Tolerance | Profile Tolerance | ±0.05mm | ±0.10mm |
| Profile Tolerance | Slot Tolerance | Normal Slot ±0.08, Routing Slot ±0.10 | Normal Slot ±0.10, Routing Slot ±0.13 |
| Lamination Capability | Layer Registration | 2mil | 3mil |
| Lamination Capability | Hybrid Lamination | PTFE + Glass Ceramic + FR4 | PTFE + Glass Ceramic + FR4 |
| Drilling Capability | Minimum Hole Size | 0.075mm | 0.10mm |
| Drilling Capability | Minimum Hole Spacing | 0.20mm | 0.25mm |
| Drilling Capability | Hole Diameter Tolerance | ±0.05mm | ±0.075mm |
| Plating Capability | Maximum Aspect Ratio | 16:1 | 12:1 |
| Plating Capability | Hole Copper Uniformity | COV≤5% | COV≤7% |
| Resin Filled Via | Resin Filled Via Aspect Ratio | 12:1 | 12:1 |
| Resin Filled Via | Via Type | Through Hole / Blind Via | Through Hole / Blind Via |
| Trace Control | Trace Width Tolerance | ±0.6mil | ±1mil |
| Impedance Control | Impedance Tolerance | ±5% | ±8% |
| Other Parameters | Warpage | 0.50% | 0.75% |
| Other Parameters | Special Process | POFV(VIPPO), Sequential Lamination, Local Lamination, Long/Short Gold Finger, Counterbore, Back Drill, Side Metallization, N+N Structure, Edge Plating, Thick Copper, HDI | POFV(VIPPO), Sequential Lamination, Local Lamination, Long/Short Gold Finger, Counterbore, Back Drill, Side Metallization, N+N Structure, Edge Plating, Thick Copper, HDI |
| High Frequency Materials | Approved Brands | Shengyi, ITEQ, Taiwan Union, Panasonic(M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola | Shengyi, ITEQ, Taiwan Union, Panasonic(M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola |
| Parameter | 2022 Sample | 2022 Mass Production | 2023 Sample | 2023 Mass Production |
| Layer Count | 18L | 12L | 20L | 18L |
| Panel Size | 400×540mm | 400×540mm | 400×540mm | 400×540mm |
| Finished Board Thickness | 0.25-3.2mm | 0.25-3.2mm | 0.25-5.0mm | 0.25-3.2mm |
| Min Trace/Space | 2mil/2mil | 2.5mil/2.5mil | 1.5mil/1.5mil | 2mil/2mil |
| Min Hole-to-Trace Clearance | 5mil | 5mil | 4mil | 5mil |
| Copper Weight | 1/3-2oz | 1/3-2oz | 1/3-3oz | 1/3-2oz |
| Layer Registration Accuracy | 1mil | 1mil | 0.8mil | 1mil |
| Min Through Hole Diameter | 0.10mm | 0.15mm | 0.075mm | 0.10mm |
| Min Laser Via Diameter | 0.05mm | 0.075mm | 0.05mm | 0.05mm |
| Max Aspect Ratio | 12:1 | 10:1 | 16:1 | 12:1 |
| Etching Tolerance | ±10%/±1mil | ±10%/±1mil | ±10%/±0.8mil | ±10%/±1mil |
| Min Solder Bridge | 3mil | 4mil | 2mil | 3mil |
| Impedance Control Tolerance | ±5% | ±8% | ±5% | ±7% |
| Surface Finish | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP |
| Supported Structures | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design |
| Material Types | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon |
| Parameter | Sample | Mass Production |
| Layer Count | 12 | 16 |
| Minimum Dielectric Thickness (μm) | 12.5 | 12.5 |
| Minimum BGA Pitch (μm) | 150 | 100 |
| Minimum Board Thickness (μm) | 50 | 50 |
| Maximum Panel Size (mm) | 610×1200 | 610×1200 |
| Minimum Base Copper Thickness (μm) | 9 | 6 |
| Maximum Base Copper Thickness (μm) | 35 | 35 |
| Minimum Trace/Space (μm) | 40/40 | 35/35 |
| Pattern Registration Tolerance (μm) | ±50 | ±20 |
| Minimum Pattern-to-Edge Clearance (mm) | 0.10 | 0.07 |
| Etching Tolerance (μm) | ±20 | ±15 |
| Minimum Through Hole Diameter (mm) | 0.10 | 0.075 |
| Minimum Blind Via Diameter (mm) | 0.05 | 0.05 |
| Hole Diameter Tolerance (mm) | ±0.05 | ±0.05 |
| Impedance Control Tolerance | ±10% | ±5% |
| Outline Tolerance (mm) | ±0.10 | ±0.05 |
| Surface Finish | HASL, ENIG, Immersion Silver, OSP, ENEPIG, Hard Gold | HASL, ENIG, Immersion Silver, OSP, ENEPIG, Hard Gold |
| Stiffener Type | FR4, PI, Stainless Steel | FR4, PI, Stainless Steel |
| Stiffener Registration Tolerance (mm) | ±0.20 | ±0.10 |
| HDI Capability | 4-Layer Any-Layer Interconnect | 6-Layer Any-Layer Interconnect |
| LCP Material Support | OK | OK |
Supported Certifications
Certification certificates can be provided upon request. Please contact our sales or support team for further information.
Reliable PCB Quality Control and Inspection
Shine PCB implements strict PCB quality control procedures, including AOI inspection, X-ray analysis, impedance testing, and final electrical verification to ensure stable performance and long-term reliability.