Fast & Reliable PCB Fabrication
ShinePCB provides precision PCB fabrication services for high-speed digital, RF, and high-frequency applications. By combining advanced material systems, optimized stack-up structures, controlled impedance manufacturing, and strict process control, we help customers achieve reliable electrical performance and consistent production quality.
Our fabrication capabilities cover multilayer PCB, HDI PCB, high-frequency PCB, rigid-flex PCB, and other complex board structures. From prototype development to volume production, every project is supported by engineering review, manufacturability optimization, and comprehensive quality assurance.
With an integrated manufacturing workflow and mature supply chain resources, ShinePCB helps customers shorten development cycles, improve first-pass success rates, and accelerate product commercialization.
Fast. Accurate. Cost-Effective.
ShinePCB bridges the gap between PCB design requirements and manufacturing execution.
Our engineers evaluate material systems, stack-up structures, via transitions, impedance targets, and fabrication tolerances before production begins, ensuring that performance objectives can be consistently achieved in manufacturing. This design-to-fabrication approach shortens validation cycles, improves first-pass success rates, and reduces overall development costs.
With expertise in multilayer, HDI, rigid-flex, and high-frequency PCB technologies, we help customers bring advanced electronic products from concept to production with confidence.
| Parameter | 2022 Sample | 2022 Mass Production | 2023 Sample | 2023 Mass Production |
|---|---|---|---|---|
| Layer Count | 40L | 32L | 50L | 36L |
| Finished Board Thickness | 0.2-12.0mm | 0.4-6.0mm | 0.2-15.0mm | 0.3-7.0mm |
| Thickness Tolerance | ±8% | ±10% | ±8% | ±8% |
| Min Trace/Space | 2mil/2mil | 3mil/3mil | 1.5mil/1.5mil | 2mil/2mil |
| Min Hole-to-Trace Clearance | 5mil | 6mil | 5mil | 5mil |
| Copper Weight | 1-10oz | 1-6oz | 1-12oz | 1/3-8oz |
| Layer Registration Accuracy | 1mil | 1mil | 0.8mil | 1mil |
| Min Through Hole Diameter | 0.1mm | 0.15mm | 0.075mm | 0.10mm |
| Min Blind/Buried Via Diameter | 0.075mm | 0.075mm | 0.05mm | 0.075mm |
| Max Aspect Ratio | 30:1 | 25:1 | 35:1 | 30:1 |
| Etching Tolerance | ±10%/±1mil | ±10%/±1mil | ±10%/±0.8mil | ±10%/±1mil |
| Min Solder Bridge | 3mil | 4mil | 2mil | 3mil |
| Impedance Control Tolerance | ±5% | ±8% | ±5% | ±7% |
| HDI Level | 7th Order | 3rd Order | 9th Order | 5th Order |
| Surface Finish | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon |
| Material Types | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) | Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free) |
| Category | Parameter | Sample | Mass Production |
| Material Type | Material System | PTFE, Hydrocarbon Resin, Other Materials | PTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber |
| Layer Capability | Layer Count | 24L | 20L |
| Layer Capability | Panel Size | 850×700mm | 720×650mm |
| Profile Tolerance | Profile Tolerance | ±0.05mm | ±0.10mm |
| Profile Tolerance | Slot Tolerance | Normal Slot ±0.08, Routing Slot ±0.10 | Normal Slot ±0.10, Routing Slot ±0.13 |
| Lamination Capability | Layer Registration | 2mil | 3mil |
| Lamination Capability | Hybrid Lamination | PTFE + Glass Ceramic + FR4 | PTFE + Glass Ceramic + FR4 |
| Drilling Capability | Minimum Hole Size | 0.075mm | 0.10mm |
| Drilling Capability | Minimum Hole Spacing | 0.20mm | 0.25mm |
| Drilling Capability | Hole Diameter Tolerance | ±0.05mm | ±0.075mm |
| Plating Capability | Maximum Aspect Ratio | 16:1 | 12:1 |
| Plating Capability | Hole Copper Uniformity | COV≤5% | COV≤7% |
| Resin Filled Via | Resin Filled Via Aspect Ratio | 12:1 | 12:1 |
| Resin Filled Via | Via Type | Through Hole / Blind Via | Through Hole / Blind Via |
| Trace Control | Trace Width Tolerance | ±0.6mil | ±1mil |
| Impedance Control | Impedance Tolerance | ±5% | ±8% |
| Other Parameters | Warpage | 0.50% | 0.75% |
| Other Parameters | Special Process | POFV(VIPPO), Sequential Lamination, Local Lamination, Long/Short Gold Finger, Counterbore, Back Drill, Side Metallization, N+N Structure, Edge Plating, Thick Copper, HDI | POFV(VIPPO), Sequential Lamination, Local Lamination, Long/Short Gold Finger, Counterbore, Back Drill, Side Metallization, N+N Structure, Edge Plating, Thick Copper, HDI |
| High Frequency Materials | Approved Brands | Shengyi, ITEQ, Taiwan Union, Panasonic(M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola | Shengyi, ITEQ, Taiwan Union, Panasonic(M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola |
| Parameter | 2022 Sample | 2022 Mass Production | 2023 Sample | 2023 Mass Production |
| Layer Count | 18L | 12L | 20L | 18L |
| Panel Size | 400×540mm | 400×540mm | 400×540mm | 400×540mm |
| Finished Board Thickness | 0.25-3.2mm | 0.25-3.2mm | 0.25-5.0mm | 0.25-3.2mm |
| Min Trace/Space | 2mil/2mil | 2.5mil/2.5mil | 1.5mil/1.5mil | 2mil/2mil |
| Min Hole-to-Trace Clearance | 5mil | 5mil | 4mil | 5mil |
| Copper Weight | 1/3-2oz | 1/3-2oz | 1/3-3oz | 1/3-2oz |
| Layer Registration Accuracy | 1mil | 1mil | 0.8mil | 1mil |
| Min Through Hole Diameter | 0.10mm | 0.15mm | 0.075mm | 0.10mm |
| Min Laser Via Diameter | 0.05mm | 0.075mm | 0.05mm | 0.05mm |
| Max Aspect Ratio | 12:1 | 10:1 | 16:1 | 12:1 |
| Etching Tolerance | ±10%/±1mil | ±10%/±1mil | ±10%/±0.8mil | ±10%/±1mil |
| Min Solder Bridge | 3mil | 4mil | 2mil | 3mil |
| Impedance Control Tolerance | ±5% | ±8% | ±5% | ±7% |
| Surface Finish | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon | ENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP |
| Supported Structures | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design | Single-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design |
| Material Types | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon |
| Parameter | Sample | Mass Production |
| Layer Count | 12 | 16 |
| Minimum Dielectric Thickness (μm) | 12.5 | 12.5 |
| Minimum BGA Pitch (μm) | 150 | 100 |
| Minimum Board Thickness (μm) | 50 | 50 |
| Maximum Panel Size (mm) | 610×1200 | 610×1200 |
| Minimum Base Copper Thickness (μm) | 9 | 6 |
| Maximum Base Copper Thickness (μm) | 35 | 35 |
| Minimum Trace/Space (μm) | 40/40 | 35/35 |
| Pattern Registration Tolerance (μm) | ±50 | ±20 |
| Minimum Pattern-to-Edge Clearance (mm) | 0.10 | 0.07 |
| Etching Tolerance (μm) | ±20 | ±15 |
| Minimum Through Hole Diameter (mm) | 0.10 | 0.075 |
| Minimum Blind Via Diameter (mm) | 0.05 | 0.05 |
| Hole Diameter Tolerance (mm) | ±0.05 | ±0.05 |
| Impedance Control Tolerance | ±10% | ±5% |
| Outline Tolerance (mm) | ±0.10 | ±0.05 |
| Surface Finish | HASL, ENIG, Immersion Silver, OSP, ENEPIG, Hard Gold | HASL, ENIG, Immersion Silver, OSP, ENEPIG, Hard Gold |
| Stiffener Type | FR4, PI, Stainless Steel | FR4, PI, Stainless Steel |
| Stiffener Registration Tolerance (mm) | ±0.20 | ±0.10 |
| HDI Capability | 4-Layer Any-Layer Interconnect | 6-Layer Any-Layer Interconnect |
| LCP Material Support | OK | OK |
Our 5-D Process
01.
Submit Your Inquiry
Click the “Get a Quote” button on our home page, upload your Gerber file, and input the full details of your specification requirements.
02.
Engineering Audit
Your inquiry will be sent directly to our internal system for an engineering review. Our team will evaluate the files and contact you to ensure all technical specifications are met.
03.
Quote Confirmation
Once the audit is complete, we will send the formal quotation and payment instructions via email. You can confirm with us directly by replying to the email. (For payment inquiries, please contact: info@.com)
04.
Track Your Progress
After the order is placed, you can track its production progress online at any time. Our engineers will perform a final review before production and notify you of any discrepancies.
05.
Deliver
Once your order is confirmed, you can monitor its real-time status through our online system. Before fabrication begins, our engineering team conducts a specialized final review and will promptly contact you regarding any technical discrepancies. Every shipment is backed by a secondary centralized 100% inspection to guarantee that your high-precision boards meet all specifications before they leave our facility.
Product terminals
Leveraging our extensive industry expertise, we consistently deliver to the highest rigorous standards. Our footprint spans a diverse range of market segments, including Telecom, Datacom, Computer & Storage, Medical, Mil/Aero, Industrial, and Consumer Electronics.
Supported Certifications
Satellite Communication
Telecom Infrastructure
Consumer Electronics
UAV Systems
Power & Energy
Medical Electronics
Networking Equipment
Reliable PCB Quality Control and Inspection
Shine PCB implements strict PCB quality control procedures, including AOI inspection, X-ray analysis, impedance testing, and final electrical verification to ensure stable performance and long-term reliability.